Elstner, R. published the artcileStudies on the effect of inhibitors in ammonia etching solutions on the depth and pattern in copper etching, Product Details of C3H8N2S, the publication is Metalloberflaeche (1982), 36(10), 468-78, database is CAplus.
The effects of inhibitors on the etching of Cu for printed circuits by ammoniacal solutions of Na chlorite and CuCl2 were studied. The etch rates and elec. conductivity of the different solutions are given. The effects of Cu(I) ions are discussed. The optimum etching conditions are described.
Metalloberflaeche published new progress about 6972-05-0. 6972-05-0 belongs to catalysis-chemistry, auxiliary class Thiourea,Amine,Aliphatic hydrocarbon chain,Amide, name is 1,1-Dimethylthiourea, and the molecular formula is C3H8N2S, Product Details of C3H8N2S.
Referemce:
https://courses.lumenlearning.com/boundless-chemistry/chapter/catalysis/,
Catalysis – Wikipedia