Rotti, P. B. published the artcileEffect of thiourea and substituted thioureas on electrocrystallization of copper, Formula: C3H8N2S, the publication is Bulletin of Electrochemistry (1987), 3(4), 305-11, database is CAplus.
The presence of traces of thiourea (TU), N,N-dimethylthiourea (DMTU) and phenylthiourea (PTU) in highly purified acid CuSO4 bath affects the morphol. of Cu electrodeposits and the cathodic polarization on Cu single crystal (100), (110) and (111) planes, in a range of c.d. 2-20 mA/cm2. At low c.d. on (100) plane these addition agents bring about a transition from layer type of deposit to ridge type and to pyramidal type of deposit which finally transformed to polycrystalline At high c.ds., layers, truncated pyramids and blocks obtained in pure solution transformed to ridges and pyramidal type which got transformed to polycrystalline deposit. The cathodic overpotentials in the presence of these addition agents were always lower compared to those observed in pure acid CuSO4 bath, but the trend in the variation of overpotential with time remained the same. The morphol. and overpotential changes observed during electroplating of Cu depend on the concentration of addition agents and the c.d. The cathodic Tafel slope of 120 + 5 mV obtained in pure bath changed slightly in the presence of these addition agents.
Bulletin of Electrochemistry published new progress about 6972-05-0. 6972-05-0 belongs to catalysis-chemistry, auxiliary class Thiourea,Amine,Aliphatic hydrocarbon chain,Amide, name is 1,1-Dimethylthiourea, and the molecular formula is C3H8N2S, Formula: C3H8N2S.
Referemce:
https://courses.lumenlearning.com/boundless-chemistry/chapter/catalysis/,
Catalysis – Wikipedia